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Christopher
Rowan Frank J. Bachner Stephen McNally Sharnaz Motakef |
Frank J. Bachner has been active in high technology and advanced microelectronic packaging for over thirty years. His experience includes both leading-edge research and day-to-day business experience with semiconductor components and advanced packaging. As a consultant to the electronics industry, he has worked with North American, Asian and European companies involved in semiconductor fabrication equipment, advanced packaging and materials. His clients cover a spectrum from large, multi-national companies to technology start-ups. He focuses on providing market analysis, business development, and strategic planning services to his client companies. He holds four patents and is the author of over 25 papers. He has given numerous presentations at conferences and technical meetings. He is a member of IEEE and IMAPS. He received his S.B. and Ph.D. degrees in metallurgy from the Massachusetts Institute of Technology (M.I.T.), Cambridge, MA, in 1961 and 1966 respectively. After serving two years as a Captain in the United States Army stationed at the Harry Diamond Laboratories in Washington, D.C., he joined the staff of the M.I.T. Lincoln Laboratory in 1968 where he worked on problems in advanced packaging for microelectronics and thin-film technology. He was appointed Assistant Leader of the Microelectronics Group in 1973 and Associate Leader in 1975. He supervised research in the design and fabrication of charge-coupled devices for optical and signal processing applications and the operations of a foundry building silicon-on-insulator, charge-coupled and surface acoustic wave devices for Laboratory programs. In 1983 he joined the Polaroid Corporation where he was the Director of Microelectronics with the responsibility for establishing a facility for the design and fabrication of silicon and gallium arsenide devices. He then joined Engelhard Corporationšs Precision Microwave Circuits Division as Technical Director with responsibility for technology and product development and the design of a green-field facility to both manufacture and do research on thin-film microwave integrated circuit substrates. Subsequently as the Marketing Manager for Ceramics Process Systems he was responsible for initiating programs to develop and manufacture alumina and aluminum nitride substrates for MCMs and Al/SiC metal-matrix components for advanced microwave packages. Most recently he was the Director of Advanced Product Programs at Alcoa Electronic Packaging where he tracked and analyzed technology developments affecting the packaging of microprocessors for personal computers. He also negotiated the funding by DARPA of a $15M program at Alcoa to advance the state-of-the-art in ceramic package manufacturing.
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